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TEST EQUIPMENT

--STI3000 Wafer Probe Test
--
STI3000 Wafer Probe Test Head
--
Product Specific Probe Rings

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-- STI9000 Mixed Signal Tester
-- Application Notes

PRODUCTS | STI3000 Wafer Probe Test | Product Specific Probe Rings

(PDF)

Configurable Probe Rings

This probe ring insert is the only component that is specific to the product or wafer under test, significantly lowering the overall system replacement cost. The STI3000E can be integrated with any probe station in the industry.

At the core of the STI3000E is STI’s proprietary Drive Sense Technology (DST). DST combines unique on-board circuitry, software and test methods to produce the most accurate representation of MEMS sensor dynamic behavior in shorter test times when compared to traditional MEMS probe test methods. The STI3000 can measure most important MEMS characteristics at the wafer level, including resonant frequency, quality factor, stiction, quadrature error, hysteresis, spring constant, f3dB frequency, capacitance and leakage. This dynamic behavior data can then be used to validate MEMS designs, monitor MEMS fabrication processes and drive product quality improvements, resulting in increased wafer-level and package-level test yields and decreased DPM rates, yielding your highest return on investment.

The STI3000E is easily configured and adapted for different product types, and is scalable for increased capacity. This simple and robust test configuration results in lower maintenance and support costs for product development and manufacturing operations. A cable set connects the STI3000E Test Head Module to the STI9000 Mixed-Signal Tester and external power supply, but all critical device test resources are located on the test head itself, resulting in significantly improved performance.

These resources include:

  • 8 channels of Drive Sense Technology (DST), the technology that combines STI’s unique on-board circuitry, software and test methods to produce the most accurate representation of MEMS sensor dynamic behavior in shorter test times when compared to traditional MEMS probe test methods.
  • 8 Digitizers
  • 8 Parametric Control Units (PMU)
  • 8 Direct Digital Synthesis Resources
  • 4 Capacitance Measurement Resources
  • On-board I2C Communications Bus


The STI3000E is also compatible with external hardware, such as LCR meters and the STI test hardware suite, providing a wide variety of test capabilities and scalability of tester resources, from one-up testing to multiple parallel device testing. The STI3000E is designed to provide the most accurate and fastest test times in the industry, ultimately resulting in lower product development and manufacturing costs.

For more detailed specifications, refer to the
STI3000E Wafer Probe Test Head Spec Sheet.




For more detailed information on the individual system components, select from the links below:

-- STI3000 Wafer Probe Test <
-- STI9000 Mixed Signal Tester
-- Application Notes

Copyright 2008 Solidus Technologies, Inc. | Colorado • Germany • Japan • France • Korea | MEMS Sensor Test Equipment & Semiconductors
3333 North El Paso Street, Suite E | Colorado Springs, CO 80907-5478, USA | Tel: +1.719.471.1960